| 摘要 |
A plurality of leads are arrayed around an island (1) to which a semiconductor chip (3) is bonded. A plurality of first wires (4) interconnects each electrode terminal of the semiconductor chip (3) and each of the plurality of leads (2), while a second wire (4b) electrically connects a ground terminal of the semiconductor chip (3) with the island (1). This island (1) is so formed that a slit (1c) may be interposed between a wire bonding portion (1b) and a die pad portion (1a). In this configuration, the island and the leads are covered by a resin package (6) in such a manner that their back faces may be exposed from this package. As a result, even in a QFN type resin-packaged semiconductor device in which the back faces of the island and the leads are exposed for direct soldering at the time of mounting, the wire bonded to the island can be prevented from being disconnected or cut off, thus making that resin-packaged semiconductor device more stable in quality.
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