| 摘要 |
Dynamic alignment of a wafer with a blade that carries the wafer involves determination of an approximate value of wafer offset with respect to a desired location of the wafer in a module. This determination is made using an optimization program. The wafer is picked up from a first location using an end effector that transfers the picked up wafer from the first location past sensors to produce sensor data. For an unknown wafer offset, the picked up wafer is misaligned with respect to a desired position of the picked up wafer on the end effector. When the desired position does not correspond to original target coordinates to which the end effector normally moves, the original target coordinates are modified to compensate for the approximate value of the offset and the picked up wafer is placed at the modified target coordinates to compensate for the unknown offset and the misalignment.
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