发明名称 Memory system capable of operating at high temperatures and method for fabricating the same
摘要 A memory system having a plurality of T-RAM cells arranged in an array is presented where each T-RAM cell has dual vertical devices and is fabricated over a SiC substrate. Each T-RAM cell has a vertical thyristor and a vertical transfer gate. The top surface of each thyristor is coplanar with the top surface of each transfer gate within the T-RAM array to provide a planar cell structure for the T-RAM array. A method is also presented for fabricating the T-RAM array having the vertical thyristors, the vertical transfer gates and the planar cell structure over the SiC substrate.
申请公布号 US6627924(B2) 申请公布日期 2003.09.30
申请号 US20010845695 申请日期 2001.04.30
申请人 IBM CORPORATION 发明人 HSU LOUIS L.;WANG LI-KONG
分类号 H01L21/00;H01L21/82;H01L27/06;H01L27/102;H01L29/74;H01L31/0312;H01L31/111;(IPC1-7):H01L29/74 主分类号 H01L21/00
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