发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing method allowing uniform and quick specular polishing well following the curved faces of concave polished surfaces and a polishing device for realizing the polishing method. <P>SOLUTION: Parts of a plurality of domed portions 11, 11a, 11b different in curvature of elastic polishing bodies 10, 10a, 10b having the domed portions 11, 11a, 11b, the areas of which are larger than those of the concave polished surfaces of polished materials 50, 50a, 50b, corresponding to the curved shapes of the polished surfaces, are polished while abutting on almost all of the polished surfaces. Polishing is performed with curvature centers 40 of the domed portions 11, 11a, 11b almost corresponding to oscillation centers 41 of the polished materials. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003275949(A) 申请公布日期 2003.09.30
申请号 JP20020368174 申请日期 2002.12.19
申请人 SEIKO EPSON CORP 发明人 MIYAZAWA MAKOTO
分类号 B24B13/01;B24B13/00;B24B37/00;B24B37/20;B24B37/24;B24D13/14 主分类号 B24B13/01
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