发明名称 Memory cell arrangement
摘要 A memory-cell array includes a substrate forming parallel first and second trenches. A transistor's upper source/drain region adjoins two of the first and two of the second trenches, and lies above its lower source/drain region. A conductive structure in a first trench associated with the transistor adjoins the upper source/drain region at its first edge. An insulating structure in the associated first trench insulates the conductive structure from a second edge and from a bottom of the associated first trench. A word line, on which is a further insulating layer, is over the upper/source drain region and parallel to the associated first trench bulges into the second trenches. Insulating spaces adjoin the word line laterally. A contact on the conductive structure and in electrical communication with the upper source/drain region connects with a capacitor.
申请公布号 US6627940(B1) 申请公布日期 2003.09.30
申请号 US20020937838 申请日期 2002.02.05
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHUMANN DIRK;SELL BERNHARD;REISINGER HANS;WILLER JOSEF
分类号 H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L27/108;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L21/8242
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