发明名称 |
Planarization system with multiple polishing pads |
摘要 |
An apparatus for simultaneously polishing wafers including at least a first and a second web of polishing media. At least two polishing heads are provided on a carrier coupled to a drive system such that one polishing head positions a wafer against the first web and a second polishing head positions a second wafer against the second web. The drive system imparts a programmed polishing motion or pattern to the polishing heads.
|
申请公布号 |
US6626744(B1) |
申请公布日期 |
2003.09.30 |
申请号 |
US20000556495 |
申请日期 |
2000.04.21 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
WHITE JOHN M.;SOMMER PHILLIP R.;FISHER STEPHEN |
分类号 |
B24B21/04;B24B37/04;B24B53/007;B24B57/02;(IPC1-7):B24B1/00 |
主分类号 |
B24B21/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|