发明名称 SOLDERING WAVE FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To solve problems that solder in a solder tank is not sufficiently stirred in a soldering wave forming device to form the soldering wave, each element composition cannot be distributed uniformly in the solder tank, and the soldering quality is degraded. SOLUTION: An electromagnetic pump 10 is provided in the solder tank 1 to form the soldering wave 33. The thrust direction of the electromagnetic pump 10 is inverted. An opening/closing means 40 for suction is provided on the position opposite to a discharge port (a first port) 11 of the electromagnetic pump 10 in the solder tank 1, the solder 2 is sucked into a suction port (a second port) 12 of the electromagnetic pump 10, and the solder 2 is circulated and stirred to each corner in the solder tank 1. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003275867(A) 申请公布日期 2003.09.30
申请号 JP20020075323 申请日期 2002.03.19
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 TOBA HIDEAKI
分类号 B23K1/08;B23K101/42;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K1/08
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