发明名称 |
Method of measuring resistance in deep trench |
摘要 |
A method of measuring resistance in a deep trench. A first substrate having a first trench with a first depth is provided. A first collar insulating layer is formed on the sidewall of the first trench. A first polysilicon layer is formed in the first trench and on the first substrate to obtain a first polysilicon plug in the first trench. The first polysilicon layer and the first substrate are doped with impurity ions, and a first N well is formed in the first substrate. The above procedures are repeated to obtain a second substrate having a second trench with a second depth not equal to the first depth. A voltage is applied to the first and second substrates respectively to obtain a first total resistance of the first substrate and a second total resistance of the second substrate. Finally, the first total resistance and second total resistance are converted by calculation to obtain a resistance of the first polysilicon plug and a resistance of the second polysilicon plug.
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申请公布号 |
US6627513(B1) |
申请公布日期 |
2003.09.30 |
申请号 |
US20020271598 |
申请日期 |
2002.10.15 |
申请人 |
NANYATECHNOLOGY CORPORATION |
发明人 |
TSAI TZU-CHIN;CHEN LIANG-HSIN |
分类号 |
H01L21/8242;H01L23/544;(IPC1-7):H01L21/76;H01L21/44 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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