发明名称 BASE PLATE FOR POLISHING SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesion base plate for polishing a substrate to polish a highly flat substrate with high reproducibility. <P>SOLUTION: The base plate for polishing a substrate is formed that the back surface of a substrate 1 to be polished is disposed on one main surface of a base plate B, having a high position adhesion surface 2 and a low position non-adhesion surface 3, through an adhesion member. A ratio occupied by the area of the low position non-adhesion surface 3 on the surface, opposed to the back surface of the substrate 1, of the substrate 1 to be polished is 20-90%. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003275953(A) 申请公布日期 2003.09.30
申请号 JP20020084099 申请日期 2002.03.25
申请人 KYOCERA CORP 发明人 INOUE SHINJI
分类号 B24B37/30 主分类号 B24B37/30
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