发明名称 Photolithography method using an antireflective coating
摘要 Antireflective structures according to the present invention comprise a metal silicon nitride composition in a layer that is superposed upon a layer to be patterned that would other wise cause destructive reflectivity during photoresist patterning. The antireflective structure has the ability to absorb light used during photoresist patterning. The antireflective structure also has the ability to scatter unabsorbed light into patterns and intensities that are ineffective to photoresist material exposed to the patterns and intensities. One preferred material for the antireflective layer includes metal silicon nitride ternary compounds of the general formula MxSiyNz, where M is at least one transition metal, x is less than y and z is greater than about 0 and less than about 5y.
申请公布号 US6627389(B1) 申请公布日期 2003.09.30
申请号 US20000631264 申请日期 2000.08.02
申请人 MICRON TECHNOLOGY, INC. 发明人 HU YONGJUN
分类号 G03F7/00;G03F7/09;G03F7/36;H01L21/027;H01L21/318;H01L21/3213;H01L27/146;H01L31/0216;H01L31/0232;(IPC1-7):G03F7/00 主分类号 G03F7/00
代理机构 代理人
主权项
地址