发明名称 Support circuit with a tapered through-hole for a semiconductor chip assembly
摘要 A support circuit is adapted to be mechanically and electrically coupled to a semiconductor chip such that the support circuit and the chip in combination form a semiconductor chip assembly. The support circuit includes an insulative base and a conductive trace embedded in the insulative base. The conductive trace is a single continuous piece of metal, the conductive trace includes a pillar that extends above the insulative base and a routing line that is substantially covered by and extends below the insulative base, and an opening in the routing line has tapered sidewalls and a diameter that increases as height increases.
申请公布号 US6627824(B1) 申请公布日期 2003.09.30
申请号 US20010002732 申请日期 2001.11.15
申请人 LIN CHARLES W. C. 发明人 LIN CHARLES W. C.
分类号 H01L21/48;H01L23/498;(IPC1-7):H05K7/06 主分类号 H01L21/48
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