| 摘要 |
On a semiconductor chip, ends of a plurality of resistive elements of a pull-up resistor unit disposed in parallel to each other are connected to a power source, other ends of the resistive elements are connected to a line connecting a signal input terminal and a receiving end device disposed on the semiconductor chip, and the line is connected to the ground through an external resistor disposed on the outside of the semiconductor chip. A current flows from the power source to the ground, and a node voltage depending on a resistance value of the external resistor and a composite resistance of the pull-up resistor unit is applied to a node between the line and the external resistor. The composite resistance of the pull-up resistor unit functioning as a termination resistor is corrected to an expected value according to the node voltage.
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