发明名称 TEMPERATURE DATA COLLECTING PROGRAM IN REFLOW SOLDERING APPARATUS AND REFLOW SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To enable an inexperienced worker to make a temperature profile after a comparatively short time of training. SOLUTION: For making the temperature profile for controlling the temperature variation of a work in a reflow furnace of a reflow soldering apparatus while properly taking pictures with a camera, a computer functions as a temperature profile making means in which the optimum temperature profile of the work in the reflow furnace according to the transition of time, a temperature data collecting means in which the temperatures and the times in the reflow furnace are controlled according to the temperature profile and the controlled temperature data of the work in the reflow furnace are collected according to the transition of time, a graphing means in which the temperature data of the work are graphically displayed on a display means, and an analyzing means in which a plurality of temperature data are selected from the temperature data collected by the temperature data collecting means and graphically displayed on the display means and simultaneously, compared with the pictures of the work photographed on the display means. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003275868(A) 申请公布日期 2003.09.30
申请号 JP20020135043 申请日期 2002.05.10
申请人 OKUHARA ELECTRIC INC 发明人 OKUHARA HIROSHI
分类号 B23K3/04;B23K1/00;B23K1/008;B23K31/02;H05K3/34;(IPC1-7):B23K3/04 主分类号 B23K3/04
代理机构 代理人
主权项
地址