发明名称 |
SEMICONDUCTOR DEVICE HAVING A BOND PAD AND METHOD THEREFOR |
摘要 |
A bond pad ( 10 ) has a probe region ( 14 ) and a wire bond region ( 12 ) that are substantially non-overlapping. In one embodiment, the bond pad ( 10 ) is connected to a final metal layer pad ( 16 ) and extends over an interconnect region ( 24 ). The bond pad ( 10 ) is formed from aluminum and the final metal layer pad ( 16 ) is formed from copper. Separating the probe region ( 14 ) from the wire bond region ( 12 ) prevents the final metal layer pad ( 16 ) from being damaged by probe testing, allowing for more reliable wire bonds. In another embodiment, the probe region ( 14 ) extends over a passivation layer ( 18 ). In an application requiring very fine pitch between bond pads, the probe regions ( 14 ) and wire bond regions ( 12 ) of a plurality of bond pads formed in a line may be staggered to increase the distance between the probe regions ( 14 ). In addition, forming the bond pads ( 10 ) over the interconnect region ( 24 ) reduces the size of the integrated circuit. |
申请公布号 |
AU2003218145(A1) |
申请公布日期 |
2003.09.29 |
申请号 |
AU20030218145 |
申请日期 |
2003.03.12 |
申请人 |
MOTOROLA, INC. |
发明人 |
DIEU, VAN DINH;LOIS, E. YONG;PETER, R. HARPER;TU ANH, TRAN;JEFFREY, W. METZ;GEORGE, R. LEAL |
分类号 |
H01L21/66;H01L21/60;H01L23/485;H01L23/58 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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