| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin having high sensitivity, giving a pattern with a high rate of a residual film and excellent in adhesion to a sealing resin by blending specified amts. of a specified polyamide, a photosensitive diazoquinone compd. and a specified phenol compd. SOLUTION: A polyamide is obtd. by allowing 1 mol arom. dicarboxylic acid deriv. represented by formula I to react with 0.6-0.99 mol arom. amiophenol compd. represented by formula II and 0.01-0.4 mol diaminosiloxane represented by formula III in a polar solvent at 10-100 deg.C and 100 pts.wt. of the polyamide is blended with 1-100 pts.wt. photosensitive diazoquinone compd. and 1-50 pts.wt. phenol compd. represented by formula IV to produce the objective positive type photosensitive resin. Since the arom. carboxylic acid deriv. reacts readily with a compd. having an amino group to form an amide compd., the resultant polyamide has a high mol.wt. favorable to the photosensitive resin. |
