DEVICE FOR PROCESSING WORKPIECES IN LOW PRESSURED PLASMA

摘要

One disadvantage of known plasma processing devices is that the current density and etching rate cannot be increased as desired if productivity is to be improved. Said devices are also operated at a high gas pressure. Devices operating at a high gas pressure are not suitable for processing ferromagnetic or thick workpieces. The inventive device consists of a device which generates a magnetic field. The workpiece is mounted as an electrode for low pressure discharge. The counter electrode is arranged outside the magnetic field. A pulsed current is applied to the workpiece and the counter electrode. The device is used for plasma-processing of workpieces with respect to material, form and thickness. A high erosion rate can be obtained at low gas pressure, resulting in high productivity.