| 摘要 |
PURPOSE: A structure for a cooling device of products using a semiconductor thermoelectric element is provided to improve shock absorbing efficiency and durability, safely protect the semiconductor thermoelectric element, and expand the life span thereof by efficiently dispersing load applied on the semiconductor thermoelectric element and making the structure a perfectly sealed vacuum not to contact with the air. CONSTITUTION: A structure for a cooling device of products using a semiconductor thermoelectric element is composed of an aluminum cold plate(1) having a first biased hanging projection at lower both sides and an epoxy injection groove at the periphery; an injection-molded plastic case forming installing and central recessed parts at middle both sides to interpose the semiconductor thermoelectric element and the cold plate therebetween in a fitting method; an extracting groove of a lead line(3) and a first nut hole formed at the periphery of the installing recessed part in injection-molding the plastic case(20) and a second nut hole(25) formed at the periphery of the central recessed part; a second hanging projection formed between the installing and central recessed parts to hang with the first hanging projection in fitting the cold plate and prevent the up and down, and right and left movements of the cold plate; conductive grease formed on the surface of a first ceramic sheet to activate the transfer of cold air to the cold plate; an epoxy formed between the center and edge of the periphery of the installing recessed part, the central recessed part, and the cold plate to cut off water and air, and hardened to make the semiconductor thermoelectric element in a perfectly sealed semi-vacuum state; and silicon(50) formed between the central recessed part and the cold plate to cut off bubble holes generated in the hardening-expansion of the injected epoxy.
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