发明名称 |
MICROWAVE MONOLITHIC INTEGRATED CIRCUIT ASSEMBLY WITH MULTI-ORIENTATION PYROLYTIC GRAPHITE HEAT-DISSIPATING ASSEMBLY |
摘要 |
A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-dissipating assembly is in thermal contact with the microwave monolithic integrated circuit. The heat-dissipating assembly has at least two pieces of pyrolytic graphite embedded within a casing. The pieces of pyrolytic graphite include a first piece of pyrolytic graphite underlying the first region and having a high-thermal-conductivity x-direction of the first piece lying within about 20 degrees of a perpendicular to the MMIC circuit plane, and a second piece of pyrolytic graphite underlying the second region and having a high-thermal-conductivity x-direction of the second piece lying within about 20 degrees of the MMIC circuit plane. The heat-dissipating assembly is preferably fabricated by hot isostatic pressing. |
申请公布号 |
AU2003222276(A1) |
申请公布日期 |
2003.09.29 |
申请号 |
AU20030222276 |
申请日期 |
2003.03.11 |
申请人 |
THE BOEING COMPANY |
发明人 |
MIR, AKBAR ALI;CARL, W. PETERSON |
分类号 |
H01L23/373;H01L25/16;(IPC1-7):H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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