| 摘要 |
PROBLEM TO BE SOLVED: To provide adequate measure against the heat radiation of a semiconductor element, while miniaturizing a substrate. SOLUTION: An electronic circuit module consists of a substrate 1, that consists of glass ceramics and has an electronic component mounting part on an upper surface and a recessed part 1a on a lower surface, a plurality of heat transfer members 5, that penetrate the substrate 1 from the bottom surface of the recessed part 1a of the substrate 1 to the upper surface and are connected to a connection pad 6 where one end is formed on the upper surface of the substrate 1, electronic components 4 that are mounted on the electronic component mounting part of the substrate 1, a semiconductor element 3 that is accommodated in the recessed part 1a of the substrate 1, and a metal case 2 that covers the electronic components 4 which are mounted on the upper surface of the substrate 1. At the same time, in the electronic circuit module, a projecting part 2a is formed inside the metal case 2 as well as its projecting part 2a is thermally connected to the heat conducting member 5 via the connection pad 6, thus miniaturizing the module as well as efficiently radiating heat which is generated from the semiconductor element 3. |
