| 摘要 |
PROBLEM TO BE SOLVED: To allow all semiconductor elements or chip carriers to appropriately adhere to a single cooling member, even if the height of the semiconductor elements or the chip carries scatters and components undulate initially and to allow a component member to be appropriately adhered, even if it is deformed due to the heat generated at operation. SOLUTION: A heat transfer member 7 where a plurality of metal small- gauge wires are formed and grease containing silver fine particles between a semiconductor element or a chip carrier 2 and a cooling member, and the semiconductor element or the chip carrier 2 and the cooling member 3 are allowed to adhere by filling a grease containing silver fine particles into the heat transfer member 7, thus achieving a satisfactory heat-transfer structure. |
