| 摘要 |
1309299 Organopolysiloxane encapsulation WACKER-CHEMIE GmbH 26 May 1970 [23 May 1969] 25095/70 Heading B5A Electrical and/or electronic components are encapsulated by transfer- or injection-moulding using a composition based on an organopolysiloxane containing alkenyl groups and siliconbonded hydrogen having a viscosity less than 500,000 cS. at 25� C. and a platinum catalyst and which is curable to a flexible structure. The component may be a resistor, a semi-conductor, a condenser, a module or an integrated circuit and is preferably coated with primer; e.g. an ethylpolysilicate or a solution of an organopolysiloxane resin, before encapsulation. The encapsulated component may be further encased in a conventional encasing resin, e.g. epoxy or polystyrene or an organopolysiloxane. The initially applied, curable organopolysiloxane may contain a blowing agent, fillers or other conventional additives. |
