| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a semiconductor having excellent quality by properly connecting bonding points by a wire. <P>SOLUTION: Upon connecting an electrode 52 and a lead 53 by the wire 2 by the movement of a capillary 1, the wire 2 is connected to the electrode 52 and, thereafter, the capillary 1 is moved to the direction of the lead 53 while forming a loop and after passing the upper part of a bonding point on the lead 53, an operation for returning the capillary 1 to the side of the electrode 52 is performed, then, the wire 2 is connected to the bonding point on the lead 53. <P>COPYRIGHT: (C)2003,JPO |
