发明名称 ELECTRONIC PART AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To solve the problem that, when a small-sized electronic part is mounted to a printed wiring board through cream solder, it is likely misaligned. <P>SOLUTION: In an electronic part, an electronic part main body 9 fixed to a first conductive film 7 is electrically connected to a second conductive film 8 disposed almost flush with the first conductive film 7, and a fixed plane of the electronic part main body 9 including a circumferential surface where the first and second conductive films 7, 8 are opposed to each other is coated with a resin 11. At least one outer end of the conductive films 7, 8 is exposed from the side wall of a cladding resin 11, and a length between upper surfaces of the conductive films 7, 8 exposed to the side wall of the cladding resin 11 and the bottom surface of the resin 11 is set to be 40μm or over. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003273291(A) 申请公布日期 2003.09.26
申请号 JP20020069929 申请日期 2002.03.14
申请人 NEC KANSAI LTD 发明人 IKEGAMI GORO
分类号 H01L23/28;H01G4/228;H01G13/00;H01L21/56;H01L23/12;(IPC1-7):H01L23/28 主分类号 H01L23/28
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