| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent shift, short circuit and insufficient joint of a semiconductor element due to fusion and cooling of a jointing agent in a semiconductor device where the semiconductor element is jointed to a pair of lead frames through the jointing agent, e.g. solder, while being held between. <P>SOLUTION: A protrusion 1a is formed on an upper lead frame 1 being jointed to the upper surface electrode 3a of a semiconductor element 3 at a position corresponding to the upper surface electrode 3a, and a recess 3b is made in the upper surface electrode 3a in correspondence with the protrusion 1a. Furthermore, a recess 2a is made in a lower lead frame 2 and the semiconductor element 3 is placed in the recess 2a. The upper surface electrode 3a of the semiconductor element 3 and the protrusion 1a on the upper lead frame 1, the bottom face electrode of the semiconductor element and the lower lead frame 2 are jointed, respectively, through a jointing agent 4, e.g. solder. <P>COPYRIGHT: (C)2003,JPO</p> |
