| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce oxidation (corrosion) caused by solder leakage (5a) in a semiconductor device having a wireless structure. <P>SOLUTION: The semiconductor device has a source pad (1) provided on the approximately central surface of a semiconductor substrate (9) and a clip tip portion (4a) fixed on the center portion of the pad (1). In the device, a solder leakage stopper (2) made of a silicon nitride film (11) is formed so as to surround the periphery of the pad (1). The stopper (2) controls the expansion of the leakage (5a). Also, an opening portion (3) is formed on at least one side of the rectangular stopper (2). The length of the portion (3) is 10% or low of the one side. Low-resistant gold electrodes (8) are formed on the inside or outside of the pad (1). <P>COPYRIGHT: (C)2003,JPO |
