MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a multilayer circuit board having high connection reliability and to provide a method for manufacturing the multilayer circuit board. SOLUTION: This multilayer circuit board 100 is formed with conductor layers 1 and 7 configuring wiring circuits on both sides of an insulating layer 2. The respective wiring circuits formed on both sides are electrically connected through a via hole 2a where a solder conductor 8 is packed, and the side wall of the via hole 2a is shaped like irregularities. COPYRIGHT: (C)2003,JPO