| 摘要 |
PROBLEM TO BE SOLVED: To prevent a movable portion from sticking on a portion around itself, in a manufacturing method of a semiconductor device provided with a laminate consisting of a first semiconductor layer and a second semiconductor layer laminated thereon through an insulating layer, and a movable section formed on the second semiconductor layer and being displaceable in response to application of dynamic quantity. SOLUTION: In this method of manufacturing a semiconductor device, since an etching speed in a trench forming process is higher than that in a movable section forming process, the amount of a protective film formed on the rear surface of the movable portion 20 as a mask can be reduced in a protective film forming process. In this way, in an etching process, even if the etching ions repelled on the surface of a charged oxide film 13 collide with the rear surface of the portion 20, needle-like projections can be prevented from being formed on the rear surface of the portion 20, and the sticking between the section 20 and the film 13 can be suppressed. COPYRIGHT: (C)2003,JPO |
