| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-processing method and a device, which are capable of analyzing an environment around a substrate as a whole, and more precisely controlling the width of line and the thickness of a resist film. SOLUTION: Parameters, such as temperature, pressure, humidity, a transfer time and the like in the substrate-processing device to have effect on the formation of a resist pattern are selected as environmental conditions around a substrate, and only normal data which enable a required resist pattern to be formed are collected from the above selected parameters (step 11). At least two main components are obtained for the normal data by the use of a main component analysis technique (step 12), and a normal region is formed (step 13). The formed normal region is used as an index, when a resist pattern is actually formed on the substrate as a product, so that it can be determined easily whether the resist pattern is normal. COPYRIGHT: (C)2003,JPO |
