摘要 |
PROBLEM TO BE SOLVED: To provide a laminated chip and its manufacturing method by which the manufacturing step can be simplified and the manufacturing unit cost be also reduced. SOLUTION: A terminal electrode pattern and a required component element pattern is coated with a silver paste on respective lamination members (S1), and the respective lamination members are laminated (S2). Then, the laminated lamination members are diced and baked to form a laminated chip (S3). Next, an external electrode formation part is plated twice by nickel (S4). At first plating, the external electrode formation part is formed as shown in Fig. 2 (A), and at second plating, one surface thereof is covered with a plating layer as shown in Fig. 2 (B). Then, a tin plating is applied by a specified thickness on the nickel-plated external electrode (S5) to complete a laminated chip. COPYRIGHT: (C)2003,JPO
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