SEMICONDUCTOR CHIP PACKAGE MARKING APPARATUS

摘要

PURPOSE: A semiconductor chip package marking apparatus is provided to be capable of improving the compatibility of the apparatus regardless of the kinds of semiconductor chip packages by using a package discriminating unit. CONSTITUTION: A semiconductor chip package marking apparatus is provided with a normal package loading unit(210) for supplying a normal type package, a transfer rail(230) for transferring the normal type package, a marking head unit(240) for carrying out a marking process at the normal type package transferred through the transfer rail, a normal package unloading unit(220) for ejecting the normal type package completed with the marking process, a CSP(Chip Size Package) loading unit(260) installed at one side of the normal package loading unit, a CSP unloading unit(270) installed at one side of the normal package unloading unit, and a package discriminating unit(280) for discriminating the feature of a semiconductor chip package transferred through the transfer rail.