| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor inspection device capable of preventing the sticking of foreign substances to a probe needle and removing the foreign substances. SOLUTION: Since the probe needle is contact-free, problems of the wear of the probe needle, needle deviations and needle bends are solved compared to a conventional method. In a conventional cleaning brush method, in the case of removing the foreign substances clamped between the probe needles, there is a risk that they can not be removed or a bristle of a brush is clamped between the probes to damage a card depending on the diameter of the bristle of the brush. Since gas is used instead of the brush, there is no limitation of a diameter and also there is no risk of damaging the probe needle. COPYRIGHT: (C)2003,JPO
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