| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact wiring board in which ball pads are disposed effectively in the board to carry multi-pin semiconductor elements. SOLUTION: When two wiring patterns at the maximum can be disposed between adjoining vias, with regard to a bond finger, a via and the wiring pattern on one surface of the board, a via 14 in a first row and a via in a second row are disposed so as to pinch a row of a bond finger 12, and also the via in the first row and the via in the second row opposed to each other are connected to a pair of adjacent bond fingers, respectively. The vias 14 in a third row and afterward are connected to the two bond fingers disposed following the pair of bond fingers by passing two wiring patterns 18 between the vias in the second row. With the bond fingers connected to the via in the first row and the via in the second row and the two bond fingers connected to the vias in the third row and afterward as a repetition unit, the wiring pattern is disposed to connect all the vias to the bond fingers. COPYRIGHT: (C)2003,JPO
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