| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for stocking/carrying precise substrates efficiently and enhancing the durability of a semiconductor component manufactured using the precise substrate, and a precise substrate protective film being used therein. SOLUTION: (1) The method for stocking a plurality of precise substrates 1 is performed while stacking them through the precise substrate protective films and containing them in a container 4. (2) The method for carrying the plurality of precise substrates is performed while stacking the through the precise substrate protective films and containing them in the container. (3) The precise substrate protective film of thermosetting resin satisfies following conditions [1] and [2] when one hour has elapsed after the precise substrate protective film is touched entirely to both surfaces of the precise substrate under a temperature of 25°C and a relative humidity of 50%. In the condition [1], moisture transferred to the precise substrate is 50 ng/cm<SP>2</SP>or less, and in the condition [2], the quantity of organic matters transferred to the precise substrate is 100 ng/cm<SP>2</SP>or less. COPYRIGHT: (C)2003,JPO |
