发明名称 |
APPARATUS FOR PLATING COOLING LINE OF INJECTION METAL MOLD |
摘要 |
PURPOSE: An apparatus for plating cooling line of injection metal mold is provided to electroless plate cooling line of large sized metal mold that is injection molded. CONSTITUTION: The apparatus for plating cooling line of injection metal mold comprises a chamber(2) which is equipped with supply line(21) and discharge line(22) respectively connected to both ends of the cooling line(51) of metal mold(5) housed in the chamber(2) and sealed in such a way that the chamber(2) can be opened or closed; and a supply unit in which pump and valve are installed on a pipe for connecting the supply line(21) and discharge line(22) to plating solution tank, pretreatment solution tank and washing solution tank respectively, wherein the apparatus further comprises a heater(4) adhered to the outer part of the metal mold(5) housed in the chamber(2).
|
申请公布号 |
KR20030075682(A) |
申请公布日期 |
2003.09.26 |
申请号 |
KR20020015036 |
申请日期 |
2002.03.20 |
申请人 |
A-TECH SOLUTION CO., LTD.;YOON, HEE SUNG |
发明人 |
KANG, SIN CHEOL;KIM, UNG GI;YOON, HEE SUNG |
分类号 |
C23C18/54;(IPC1-7):C23C18/54 |
主分类号 |
C23C18/54 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|