发明名称 APPARATUS FOR PLATING COOLING LINE OF INJECTION METAL MOLD
摘要 PURPOSE: An apparatus for plating cooling line of injection metal mold is provided to electroless plate cooling line of large sized metal mold that is injection molded. CONSTITUTION: The apparatus for plating cooling line of injection metal mold comprises a chamber(2) which is equipped with supply line(21) and discharge line(22) respectively connected to both ends of the cooling line(51) of metal mold(5) housed in the chamber(2) and sealed in such a way that the chamber(2) can be opened or closed; and a supply unit in which pump and valve are installed on a pipe for connecting the supply line(21) and discharge line(22) to plating solution tank, pretreatment solution tank and washing solution tank respectively, wherein the apparatus further comprises a heater(4) adhered to the outer part of the metal mold(5) housed in the chamber(2).
申请公布号 KR20030075682(A) 申请公布日期 2003.09.26
申请号 KR20020015036 申请日期 2002.03.20
申请人 A-TECH SOLUTION CO., LTD.;YOON, HEE SUNG 发明人 KANG, SIN CHEOL;KIM, UNG GI;YOON, HEE SUNG
分类号 C23C18/54;(IPC1-7):C23C18/54 主分类号 C23C18/54
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