| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the surface flatness of a semiconductor supporter of a semiconductor holder comprising a metal 7 and a bond layer for bonding the semiconductor supporter to the metal member 7, and control the temperature of a wafer surface. <P>SOLUTION: The semiconductor supporter 12 comprises a semiconductor support 1 having a flat surface for supporting a semiconductor, a metal member 7 and a bond layer 27 for bonding the semiconductor support 1 to the metal member 7. The bond layer 27 is an adhesive sheet 4 containing a resin matrix 11 and a filler 10 dispersed in the resin matrix 11. <P>COPYRIGHT: (C)2003,JPO</p> |
