| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic substrate for a semiconductor manufacturing/ inspecting device in which the connection reliability with an external terminal of a through-hole part is excellent. <P>SOLUTION: In the ceramic substrate for the semiconductor manufacturing/ inspecting device having a through-hole for securing the electric connection of a conductor and the external terminal formed inside the ceramic substrate, at least a part of the through-hole is composed of conductive ceramic. <P>COPYRIGHT: (C)2003,JPO</p> |
