FRAME FOR NON-CONTACT IC CARD, AND NON-CONTACT IC CARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a frame for a non-contact IC card which can protect a semiconductor chip from any externally applied force such as bending, and a non-contact IC card.

SOLUTION: In a frame 11 for a non-contact low-profile IC card in which a conductor 2 is coiled a plurality of turns on a substantially same plane, flat coils 12 having a mounting unit 26 to mount a semiconductor element 40 integrally with the conductor 2 are supported by an outer frame 14 and continuously provided in the longitudinal direction, slits 30 are formed in an area except a part to mount the semiconductor element 40 of the mounting unit 26 of each flat coil 12.

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