| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module for shielding inter-element radio wave interference equipped with chips which are mounted on an MCM circuit board and simply sealed and restrained from radio wave interference from each other. SOLUTION: Discrete active element chips 3 mounted on a circuit board 1 where wiring 2 is provided are coated with an electromagnetic wave absorbing layer 6, which is composed of an insulating resin of resistance 10<SP>10</SP>Ωcm or above and metal particles that are dispersed in it, through the intermediary of a coating resin layer 5. COPYRIGHT: (C)2003,JPO
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