| 摘要 |
PURPOSE: A semiconductor package structure is provided to be capable of preventing the sagging phenomenon of a wire while conserving package appearance by using a supporting protrusion having a predetermined height. CONSTITUTION: A semiconductor package structure is provided with a semiconductor chip(10), a heat sink(20) for loading the semiconductor chip and releasing the heat generated from the semiconductor chip, a lead frame(30) located at both sides of the heat sink having a lead, and a wire(40) connecting the lead of the lead frame to the semiconductor chip. The semiconductor package structure further includes a supporting protrusion(31) having a predetermined height, formed at one side of the lead frame for preventing the sagging phenomenon of the wire. Preferably, the supporting protrusion is formed by carrying out a bending process at one side of the lead frame.
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