发明名称 |
PLASMA PROCESSING APPARATUS AND PROCESSING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and a processing method thereof for preventing a breakdown of a lower portion of vacuum vessels, such as a vacuum vessel and a pump caused by an abnormal electrical discharge like an arc electrical discharge or the like. <P>SOLUTION: Plasma discharged toward the lower portion of the vacuum vessels can be restrained through positioning a lattice-like conductive shield around an electrode, on which a substrate is positioned and changing a flow ratio of a gas fed into the vacuum vessels. <P>COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003273080(A) |
申请公布日期 |
2003.09.26 |
申请号 |
JP20020068096 |
申请日期 |
2002.03.13 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YASHIRO YOICHIRO;KAI TAKAYUKI;SASAKI TOMOYUKI |
分类号 |
H05H1/46;B01J3/00;B01J3/02;B01J19/08;C23C16/44;H01L21/304;H01L21/3065 |
主分类号 |
H05H1/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|