MOUNTING METHOD FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT DEVICE AND SEALING RESIN USED FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To solve the problem that conductively connected joining parts of an electronic component are peeled off since the electronic component is conductively connected and fixed with a circuit board in a bent state because the component main body of the electronic component is bent by suction force while the electronic component mounted on an electronic component loader is sucked and clamped at the component main body, the electronic component is released from the electronic component loader after it is fixed, and restoration force to restore the bent state to an original state pressurizes the joining part of the circuit board and the joining part of the electronic component after they are released.

SOLUTION: A mounting method for the electronic component comprises: a process of applying a sealing resin whose thixotropic degree is 1.7 to 4 to at least one of the electrode surface of the electronic component and the electrode surface of the circuit board; a process of positioning the electrode of the electronic component and the electrode of the circuit board; and a process of vibrating at least one of the electrode of the electronic component and the electrode of the circuit board. Thus the electrode of the electronic component and the electrode of the circuit board are conductively connected.

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