| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a system and a method for employing a preformed film in the transfer molding process for an integrated circuit, which is known as 'film-assisting mold'. <P>SOLUTION: The system and the method employ the preformed film in the transfer molding process employing a transfer mold to seal a part of the integrated circuit by a molding compound. The configuration of the film copies the molded cavity of the transfer mold by preforming the film composed of a soft substance. Next, the preformed film is arranged so as to be neighbored to the surface of the molded cavity of the transfer mold. The molded cavity is filled with the molding compound to seal the integrated circuit. The preform of the film permits to employ a substance, not proper to use the same in the case of a conventional method. <P>COPYRIGHT: (C)2003,JPO</p> |
