| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip capacitor which is improved in strength and reliability of bonding between its anode lead wire and anode terminal plate, a method of manufacturing the same, and the anode terminal plate. SOLUTION: At least, one of a pair of projections provided to the anode terminal plate is set higher than a site where the anode lead wire is placed, the end face of the tip of the projection located above the anode lead wire is irradiated with a laser beam to be heated and melted, and the above molten material covers the top surface of the anode lead wire and is cooled down to weld the anode lead wire to the projection. COPYRIGHT: (C)2003,JPO
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