| 摘要 |
PURPOSE: A thermosetting resin composition for underfilling is provided, to improve the joining confidence at the interface by protecting from the mechanical and thermal impact by filling the composition at the interface between a PCB and components on the board. CONSTITUTION: The thermosetting resin composition comprises 100 parts by weight of an epoxy resin; 3-80 parts by weight of a modified polyamide as a latent curing agent; 0.1-10 parts by weight of an adhesive strength promoter; and 0.1-10 parts by weight of a flowability controller. Preferably the epoxy resin comprises the combination of a plastic epoxy resin having an ester group in molecule and a reactive diluent up to 40 wt% in the total epoxy resin; the modified polyamine is at least one selected from the group consisting of a urea-modified polyamine, an alkyl-modified dicyandiamide and an alkyl-modified imidazole; and the adhesive strength promoter is at least one selected from the group consisting of a phosphate ester adhesive strength promoter, a silicon-based coupling agent and a titanate-based coupling agent. |
