| 摘要 |
PURPOSE: An EMI(Electro-Magnetic Interference) and ESD(Electro-Static Discharge) shielding apparatus using a plastic can within a board of an electronic product is provided to prevent the short circuit and the thermal deformation due to the soldering by using the plastic can and an adhesive. CONSTITUTION: An EMI and ESD shielding apparatus using a plastic can within a board of an electronic product includes a plastic plate, a metallic thin film, an adhering portion, and a ground portion. The plastic plate includes one or more shielding room for protecting components(110) from EMI and ESD, a flange formed at an edge of the shielding room, and one or more hole(230) formed at the flange. The metallic thin film is used for shielding the EMI and the ESD. The adhering portion adheres a back side of the flange on a shielding region. The ground portion connects the metallic thin film to the ground pattern of a PCB(100). The back side of the flange is adhered on the ground pattern of the PCB(100) in order to protect the components(110) from the EMI and the ESD.
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