CARRYING PALLET FOR FPC BOARD AND METHOD FOR PACKAGING SEMICONDUCTOR CHIP ON FPC BOARD

摘要

PROBLEM TO BE SOLVED: To provide a carrying pallet for FPC board through which a semiconductor chip can be packaged on the FPC board economically with high work efficiency.

SOLUTION: The carrying pallet 11 is formed as a multilayer board of a nonelastic support 12 as a reinforcing board, a first silicon elastomer layer 13a formed on the nonelastic support 12, and a second silicon elastomer layer 13b formed on the first silicon elastomer layer 13a. The first silicon elastomer layer 13a is formed to have a shear modulus G' in the range of 3.0×104Pa-5.0×106Pa measured by dynamic viscoelasticity measurement at a frequency of 10 Hz and a temperature of 20°C. Similarly, the second silicon elastomer layer 13b is formed to have a shear modulus G' in the range of 5.0×105Pa-5.0×106Pa.

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