| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for low dielectric constant film formation or the like for forming a low dielectric constant film of high strength. SOLUTION: The composition for low dielectric constant film formation contains a siloxane resin, having a thermally decomposable group, decomposing thermally at 150-350°C, in a side chain. It is preferable that the thermally decomposable group includes at least either ester coupling or ether coupling, the siloxane resin is obtained to polymerize a silane compound, which is a group including at least one of ester coupling and ether coupling in four groups coupled in silane, the silane compound is expressed by at least one of formula (1) and formula (2), and weight average molecular weight (Mw) of the siloxane resin is in the range of 5,500-50,000,000. COPYRIGHT: (C)2003,JPO
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