| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board appropriate for packaging an electronic component to be operated at high speed by relaxing an inconsistency of characteristic impedance in the connection part of a connection pad to connect the high frequency signal electrode of the electronic component and a wiring conductor. <P>SOLUTION: In a wiring board 1, a connection pad 2 to connect the high frequency signal electrode of the electronic component, a wiring board 5 led out of the connection pad 2 for transmitting a high frequency signal and an insulation protecting layer 3 for covering the peripheral parts of the wiring conductor 5 and the connection pad 2 are formed on the surface of an insulated substrate 4, the insulation protecting layer 3 covers the wiring conductor 5 from an opening 8 on the connection pad 2 to the end of the length of (2n-1)/4 multiple ((n) is a natural number) of the wavelength of the high frequency signal and the wiring conductor 5 is exposed beyond the end of the length Inconsistency of characteristic impedance in the wiring conductor 5 caused by a nonuniformity in thickness of the insulation protecting layer 3 can be prevented, a transmission loss is reduced and signal delay does not occur, either. <P>COPYRIGHT: (C)2003,JPO |
