| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical module, related to which a mounting size is miniaturized and heat-release characteristic from a package is easily improved, and a method for mounting it. <P>SOLUTION: A semiconductor laser module 1 comprises a package 2 for housing a semiconductor laser element and DIL type leads 28 provided on both side surfaces of the package 2, respectively. Since the base end of each of the leads 28 is firmly fixed to the side of the package 2 at a position upper than a bottom surface, the lead 28 can be bent in lateral direction at the position upper than the bottom surface. Thereby the semiconductor laser module 1 can be surface-mounted on a wiring board 32, and the bottom surface of the package 2 can tightly be adhered to the wiring board 32. <P>COPYRIGHT: (C)2003,JPO |
