| 摘要 |
PROBLEM TO BE SOLVED: To enable an electronic part to be mounted on a substrate with a sufficient strength only by means of a solder dip process, even if there is a burr caused during formation on the lead frame of the electronic part. SOLUTION: In the electronic part comprising a lead frame 1B, with which the electronic part is mounted on the surface of a substrate by solder dip, a recess 2 the depth of which becomes deeper toward the edge of the lead frame 1B is formed on the lead frame 1B in order to guide the solder from the edge of the lead frame 1B onto the lead frame during solder dip. COPYRIGHT: (C)2003,JPO |
